Silicone Thermally Conductive Encapsulant

Thermally conductive encapsulant designed for fast fill rates and reworkability with moderate thermal conductivity gray 3 200 addition cure.

Silicone thermally conductive encapsulant.

Thermally conductive silicones from dow come in a wide range of viscosities cure speeds and delivery systems to meet the growing need for improved thermal management in electronics designs for virtually every industry. Fast cure 2 component room temperature curable thermally conductive potting material. Thermally conductive silicone encapsulant. Unable to complete action likely due to connectivity to dow s back end service.

Good thermal conductivity 0 7 w m k low viscosity 4000cps. Two part 1 1 1 hr 40 24 hrs 30 min 60 c 1 58 45 1 8 85 24 ul 94 v 0 dowsil cn 8760 thermally conductive encapsulant even higher flow version of dowsil cn 8760 g encapsulant dark gray 2 700. Home thermally conductive silcool tia208r thermally conductive silicone encapsulant. The practice of using silicone in encapsulating and potting electronic components is a well established process designed to protect delicate circuitry.

Silco therm thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. Primerless adhesion to metals and plastics. Lord cooltherm sc 324 thermally conductive silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical electronic encapsulating applications while retaining desirable properties associated with silicones. Dowsil cn 8760 thermally conductive encapsulant please contact dow for distribution options available for this product.

They also provide protection from harsh environments vibration and thermal shock.